This UV laser marking machine uses 355nm high-energy UV photons to damage molecular bond at the surface layer of materials. It is a “cold” photo-ablation process and suitable for the applications where heat affected zones are not allowed, for example, marking circuit boards or chips.
Due to metal materials have a strong ability to absorb ultraviolet ray than infrared ray, this UV laser marking machine is more suitable for metal materials. It also can mark glass with a reduced risk of microfracture.Features
UV laser marking machine is designed for hyperfine marking and engraving. It is suitable for a wide scope of applications including marking polymer materials, LCD glass substrates, glassware, electronic components, communication equipment, car parts, precision instrument, tobaccos, animal identification labels, etc. It also can be used in some special applications such as forming micro-holes and blind holes on silicon wafer, removing metal surface coating.
|Model||ET- UV3 / ET-UV5 / ET-UV10|
|Laser type||UV source|
|Laser power(W)||3W(5W,10W optional)|
|Marking scope(mm)||50x50,100*100, 200*200mm|
|Minimum line width||0.01mm|
|Repeat position accuracy||±0.001MM|
|Cooling type||Water cooling|
|Acceptable graphic format||PLT, DST, AI, DXF, BMP, JPG, CAD, CDR, DWG|
|Operating voltage||AC 110/220V±10%, 50/60Hz|
|Operating temperature range||10-35 ℃|
|Operating humidity||< 75%(Non-condensing)|
|Machine power||< 1000W|
|Laser safety classification||Class 4|